Product introduction
LGA stands for Land Grid Array, literally translated as Grid Array package. The main reason is that it replaces the needle-like pins with metal contacts.

Product features
LGA’s packaging technology is the point contact technology (contact), mainly because it uses metal contact packaging technology (LGA) instead of the past needle-like pin type packaging technology. The package is designed as a pin less pad to make it occupy a smaller PCB area. The internal circuit of the substrate can be customized, which can greatly reduce the difficulty of the internal welding line of the package. It provides a convenient and customized scheme for complex multi-function chip design.

Application
LGA is a mature industry packaging standard, commonly used in processors, logic, memory, wearable, 3C digital, medical equipment electronics, security chips and other fields.

Process characteristics
Refer to or meet JEDEC standards
Customized design lead frame design and multi-specification pad size to meet different customer needs
Green manufacturing, lead-free process

Reliability test standard
The test criteria is zero defects in 77 sampling units
JEDEC Prerequisite: J-STD-20/JESD22-A113
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature cycle test: -65~150 ℃, JEDEC22-A104
High temperature storage test: 150°C, JEDEC 22-A103
High acceleration stress test: 130°C/85% rh /33.5 PSIA, JEDEC 22-A110/A118